Automated chip packaging

Dec 12, 2025

Mangiter na mensahe .

 

Chip Bonding / Die Bonder

Say chip bonding so sankasensitiboan ya kundang ed produksyon na RFID inlay. No saray parametro ed bonding station et onkupas na daiset, say pass rate ed RF testing so mangipatnag ed satan a tampol.

 

No sinmabi so wafer, saray chips et wala ni ed blue tape. Say kagawaan et walay ejector pin ya ontutulak manlapud leksab bangta say vacuum nozzle et manlalapud tagey, ya sakey-sakey ya eekalen iray chips. Say diametro na ejector pin et mas melag nen say chip, manga sakey milimetro, tan kaukolan ya itulak ed sentro na chip. No ontulak itan ed -sentro, say chip et onkiling tan ag naala na nozzle. Say blue tape et walaan na nanduruman grado na adhesion. Say andukey ya UV curing et mankabaliksan na mas makapuy ya adhesion ya mamainomay ed panag-ala, balet saray chips et nayarin onalis legan ya iyakar. Kada no man-switch tayo na balon batch na blue tape, kaukolan tayoy mangala na technician pian na-verify so ejector height tan ejection speed. Masyadon maples tan say chip et ontaynan, masyadon matantan tan naapektoan toy panaon na siklo.

 

Say chip et ontaynan ya akaarap ed tagey, kanian kaukolan ya ibaliktad pian saray bumps et akaarap ed leksab parad panag-bonding. Say kagawaan mi et manguusar na flip station ya paraan. Say nozzle et mangiyan na chip ed flip station, say station et man-rotate na 180 degrees, insan walay sananey ya nozzle ya mangala ed satan manlapud biek a dapag. Wala ray pabrika ya manguusar na saray nozzle ya man-rotate ed sarili da, kanian makatipid na sakey a handoff, balet ta kaukolan so stable ya vacuum pressure. Antokaman ya pananguman na presyon tan onlelereg so chip. Wala ni sakey a bengatla nipaakar ed sayan pananguman. Say reperensya na posisyon na chip et kaukolan ya mantinien. Kayari na panag-flip, say deviation ed X, Y, tan θ et ag nayarin baleg, ta no andi say vision compensation range et ag magenap ed saginonor.
Say substrate na antenna et PET roll stock, kaslakan et 50 o 75 microns so kapal to, tan walay aluminum antenna patterns ya akaukit la ed satan, pigaran libon metro kada roll. Say PET et ompaway ed unwind side, ondalan ed pigaran tension roller, tan ontunda ed bonding station. Kayari na pangiyan na kada chip, say web et onabante na sakey a tono, ontunda, tan mankakasakey lamet. Say tension et kaslakan ya nakontrol ed loob na pigaran Newton. Masyadon maluag tan say web et onlelereg ya pansengegan na lingo ed pangiposisyon, masyadon masimpit tan say PET et onnatnat ya mamapaermen ed sukat na pattern na antenna. Walay insidente mi ya say tension sensor ed rewind side et inmawet, say interon roll na antenna et aderal, say testing et ag tinmalona, ​​tan inisip na kustomer ya walay aliwa ed saray chips mi.

 

Say pangiter na adhesive et nagagawa antis ya manpeket. Say ACA et mankabaliksan na Anisotropic Conductive Adhesive. Saya et epoxy resin base ya walay conductive particles ed loob to. Saray conductive particles et kaslakan ya plastik ya bola ya pinaltokan na nickel insan balitok, ya manga 3 anggad 5 microns so diametro to, ya intaytayak ed adhesive. Antis ya onabig et nitaytayak iray partikulo. Legan na compression et naipit iratan ed baetan na saray chip bumps tan antenna pads, ya mamawala na conductivity. Saray lugar ya ag-a-compress et walaan ni na saray nitaytayak ya partikulo tan mansiansian ag--konduktibo. Sayan bengatla et mabmabli, pigaran libon yuan kada kilo, tan saray imported ya tatak a singa say Hitachi tan Sony et mas mabli ni. Kaukolan ya kontroladon maong so karakel na pangiter. Manguusar kami na needle dispensing, ya mangidedeposito kami na daiset a miligramo ed kada pankanawnawa. No daiset tan say contact resistance et ontagey ya mamapaabeba ed read range, masyadon dakel tan onlelereg ya mangikokonekta ed saray asingger ya trace ya pansengegan na shorts. Walay balon machine operator mi ed pabrika mi ya angitagey na dispensing air pressure, sakey ya interon batch so pinmaway tan saray kustomer et nanreklamo nipaakar ed saray shorts ed inerman a pasen, baleg so nagastos mi bilang bayad. Wala ray pabrika ya manguusar na stencil printing parad adhesive, mas maples balet kaukolan mon umanen so stencil no manpapalit kay produkto, aliwan makatipid parad melag iran batch ya dakel so SKU.

RFID antenna substrate roll
 
ACA/ACF
Say compression step so sankaimportantian. Say bond head so mangaawit ed chip tan ipepeket tod saray antenna pads. Say tagey tan leksab a kamera et akaala la na saray posisyon na chip bump tan posisyon na pad ya manbibiigan, say software et manggagawa na image recognition pian nakalkula so deviation ed XY ya direksion tan anggulo, insan say mechanical arm so man-compensate. Say kagawaan mi et walay repeat positioning accuracy ya manga plus o minus 20 anggad 30 microns, magenap la parad HF chips lapud mas baleg so chip tan mas malapar so bump pitch. Saray UHF chips et mairap. Wala ray chips ya 0.4mm square labat ya walay duaran bump to. Agka onlampas na daiset tan ag ka la onlapag ed pad.
 

 

 

Kayari na pangipitpit, say petang so mamaabig ed adhesive. Say kagawaan mi et walay heating block to ed bond head, tan say plataporma ed leksab et nayarin manpainit met. Kaslakan et ipapasen mi so tagey ed manga 170 degrees tan say leksab ed 150 o 160 degrees, pian say petang et onagus manlapud duaran dapag ya mamaarap ed pegley pian mas parepareho so panag-ayos. I-hold ed loob na 10 anggad 20 segundo depende ed klase na adhesive. Say ACA curing et manunan sakey a crosslinking reaction na epoxy resin. No kulang so temperatura o oras tan kulang so crosslinking, ag-itan nagawaan no gawaen so 85℃85% humidity aging tests ed saginonor. Balet no atagey so temperatura, ag met itan nasarag na PET substrate, mankurongkurong tan onkupas. Importante met so pressure. Masyadon daiset tan saray konduktibon partikulo et ag-onkupas a patatdang, kulang so contact area tan atagey so resistensya. No sobra tan say plating ed tapew na partikulo et manbitak kanian lalon onloor so pankontak, odino say adhesive et naipit tan ag-onkukurang so inkaapag-apag na partikulo. Sarayan taloran parametro et amin et mankakasakey. Umanen so sakey tan kaukolan mon umanen so arum. Say kagawaan et mantitipon na dinosena na parameter recipes parad nanduruman kombinasyon na chip tan adhesive, i-load mo labat iratan no manpapasaliw kay produkto.

ACA/ACF

 

 

Kayari na pakatambal na sakey a chip, onaligwas so web tan onloob so onsublay ya antenna pian mantultuloy. Say maples ya kagawaan et makapan-bond na duara o taloran chips kada segundo. Mas maples ni so pangi-import na Mühlbauer, balet saray daan ya kagawaan mi ed pabrika et manga sakey labat ed kada segundo. Say pangi-upgrade ed sakey a linya et manbili na pigaran milyon tan ag-itan abobonan na amo. Say rewind side et walaan met na tension control. Agnayarin i-squere iray chips, balet ag nayarin masyadon maluwag odino say roll et magmaliw ya magulo.

 

Parad panagsukimat et gawaen mi itan ya inline. Kayari na pan-bonding et ondalan itan ed RF reader. Saray yunit ya agmakabasa et namarkaan na inkjet, insan ipulisay legan na panag-slitting. Kaiba ed panagsukimat no kasin onkiwas so chip, no kasin normal so pambasa tan pangisulat na EPC, tan no kasin magenap so sensitivity. Wala ray pabrika ya manggagawa na offline testing, ya asumpal da nin unona so interon roll insan da ipapaandar ed sakey a test machine, et mankaukolan na mas dakel a trabahador balet daiset so gastos ed kagawaan. Kaukolan mon naabot so onsulok ed 99% ya pass rate pian nawalaan kay tubo. Diad leksab na satan et agmo anggan nabayaran so labor tan materyales, agla pigan reklamo na saray kustomer tan gastos ed panag-rework.

 

Ipawit so Pantepet